SILICON MICRO MOTHERBOARDS FOR THREE-DIMENSIONAL ASSEMBLING OF MICRO SYSTEMS
نویسندگان
چکیده
منابع مشابه
Silicon micro-masonry using elastomeric stamps for three-dimensional microfabrication
We present a micromanufacturing method for constructing microsystems, which we term ‘micro-masonry’ based on individual manipulation, influenced by strategies for deterministic materials assembly using advanced forms of transfer printing. Analogous to masonry in construction sites, micro-masonry consists of the preparation, manipulation, and binding of microscale units to assemble microcomponen...
متن کاملPrecision Assembling and Hybrid Bonding for Micro Fluidic Systems
An automated process is described to assemble highly functionalized micro fluidic cartridges. Different materials such as glass, silicon and thermoplastics can be bonded using adhesive gaskets. The assembling and bonding sequence is realized at room temperature so that the biological function of the cartridge is fully preserved. Several control tests for alignment and orientation are integrated...
متن کاملTowards multi-level modeling of self-assembling intelligent micro-systems
We investigate and model the dynamics of two-dimensional stochastic self-assembly of intelligent micro-systems with minimal requirements in terms of sensing, actuation, and control. A microscopic agent-based model accounts for spatiality and serves as a baseline for assessing the accuracy of models at higher abstraction level. Spatiality is relaxed in Monte Carlo simulations, which still captur...
متن کاملThree-dimensional X-ray micro-velocimetry
A direct measurement of three-dimensional X-ray velocimetry with micrometer spatial resolution is presented. The key to this development is the use of a Laue crystal as an X-ray beam splitter and mirror. Three-dimensional flow velocities in a 0.4 mm-diameter tubing were recorded, with <5 µm spatial resolution and speeds of 0.7 mm s(-1). This development paves the way for three-dimensional veloc...
متن کاملMicro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects
Related Articles Electrical characterization of a-InGaZnO thin-film transistors with Cu source/drain electrodes Appl. Phys. Lett. 100, 112109 (2012) Mechanism for resistive switching in an oxide-based electrochemical metallization memory Appl. Phys. Lett. 100, 072101 (2012) The role of eddy currents and nanoparticle size on AC magnetic field–induced reflow in solder/magnetic nanocomposites J. A...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: IEEJ Transactions on Sensors and Micromachines
سال: 1998
ISSN: 1341-8939,1347-5525
DOI: 10.1541/ieejsmas.118.444